Xihua Wang

Associate Professor, Faculty of Engineering - Electrical & Computer Engineering Dept

Contact

Associate Professor, Faculty of Engineering - Electrical & Computer Engineering Dept
Email
xihua@ualberta.ca
Phone
(780) 492-3523
Address
11-358 Donadeo Innovation Centre For Engineering
9211-116 St
Edmonton AB
T6G 2H5

Overview

Area of Study / Keywords

Microsystems and Nanodevices Photonics and Plasmas Solid State Electronics


About

Xihua Wang received his BSc degree in Physics from Peking (Beijing) University in 2003, and his Masters and PhD degrees in Physics from Boston University in 2005 and 2009, respectively. He was a Postdoctoral Fellow in the Department of Electrical and Computer Engineering at the University of Toronto from 2009 to 2012. He joined the Department of Electrical and Computer Engineering at the University of Alberta as an Assistant Professor in July 2012. He received tenure and was promoted to Associate Professor in July 2018. 



Research

Research Interests:

  • Photovoltaics
  • Optoelectronics
  • Micro-/nanophotonics
  • Flexible electronics


Current Research:

My current research is centered in the general areas of solid-state electronics and photonics with particular attention to apply nanomaterials and micro-/nanofabrication for next-generation electronic, photonic, and optoelectronic devices. The research projects include design, fabrication, and characterization of colloidal quantum dot (CQD) and cellulose nanocrystal (CNC) based electronic and photonic devices, as well as micro-/nanostructured devices for sensing and energy harvesting.  



Courses

ECE 455 - Engineering of Nanobiotechnological Systems

Microfluidic and nanobiotechnological devices. Fabrication techniques for devices: self-assembly, lithographic technologies. Applications of nanobiotechnology in computing, electronics, human health, environment and manufacture. Prerequisites: MATH 201 or PHYS 230. Credit may be obtained in only one of ECE 455 or E E 455.


ECE 559 - Microfabrication and Nanofabrication Topics II

The fabrication process for microelectronics and MEMs applications. Overview of processing steps: silicon wafer material, oxidation, lithography, diffusion, etching and ion implantation, chemical and physical vapor deposition, metallization. Process model. Yield, packaging, and assembly.


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