The fabrication process for microelectronics and MEMs applications. Overview of processing steps: silicon wafer material, oxidation, lithography, diffusion, etching and ion implantation, chemical and physical vapor deposition, metallization. Process model. Yield, packaging, and assembly.
Section | Capacity | Class times | Instructor(s) |
---|---|---|---|
LECTURE B2
(19466) |
30 |
2024-01-08 - 2024-04-12 (TR)
09:30 - 10:50
GSB 5-11
|
Primary Instructor: Xihua Wang
|