The fabrication process for microelectronics and MEMs applications. Overview of processing steps: silicon wafer material, oxidation, lithography, diffusion, etching and ion implantation, chemical and physical vapor deposition, metallization. Process model. Yield, packaging, and assembly.
| Section | Capacity | Class times | Login to view Locations |
|---|---|---|---|
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LECTURE B01
(78748) |
30 |
2027-01-04 - 2027-04-09 (TR)
11:00 - 12:20
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Primary Instructor: Xihua Wang
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