The fabrication process for microelectronics and MEMs applications. Overview of processing steps: silicon wafer material, oxidation, lithography, diffusion, etching and ion implantation, chemical and physical vapor deposition, metallization. Process model. Yield, packaging, and assembly.
| Section | Capacity | Class times | Login to view Instructor(s) and Location |
|---|---|---|---|
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LECTURE B2
(79439) |
30 |
2025-01-06 - 2025-04-09 (MW)
12:00 - 13:20
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| Section | Capacity | Class times | Login to view Instructor(s) and Location |
|---|---|---|---|
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LECTURE B1
(84668) |
30 |
2026-01-05 - 2026-04-10 (TR)
11:00 - 12:20
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