Microfabrication processes for CMOS, bipolar, MEMS, and microfluidics devices. Laboratory safety. Deposition processes of oxidation, evaporation and sputtering. Lithography, wet and dry etch, and device characterization. Note: Consent of Department required. Credit may be obtained in only one of ECE 457 or E E 457.
| Section | Capacity | Class times | Login to view Instructor(s) and Location |
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LECTURE A1
(55110) |
28 |
2025-09-02 - 2025-12-08 (TR)
08:00 - 09:20
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LAB D11
(53535) |
4 |
2025-09-02 - 2025-12-08 (M)
14:00 - 15:50
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LAB D21
(50752) |
4 |
2025-09-02 - 2025-12-08 (T)
14:00 - 15:50
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LAB D22
(55863) |
4 |
2025-09-02 - 2025-12-08 (T)
16:00 - 17:50
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LAB D31
(50717) |
4 |
2025-09-02 - 2025-12-08 (W)
14:00 - 15:50
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LAB D32
(55864) |
4 |
2025-09-02 - 2025-12-08 (W)
16:00 - 17:50
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LAB D41
(53566) |
4 |
2025-09-02 - 2025-12-08 (R)
14:00 - 15:50
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LAB D51
(50716) |
4 |
2025-09-02 - 2025-12-08 (F)
14:00 - 15:50
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| Section | Capacity | Class times | Login to view Instructor(s) and Location |
|---|---|---|---|
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LECTURE B1
(80454) |
20 |
2026-01-05 - 2026-04-10 (MWF)
09:00 - 09:50
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| Section | Capacity | Class times | Login to view Instructor(s) and Location |
|---|---|---|---|
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LAB H11
(86138) |
4 |
2026-01-05 - 2026-04-10 (M)
14:00 - 15:50
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LAB H21
(85957) |
4 |
2026-01-05 - 2026-04-10 (T)
14:00 - 15:50
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LAB H31
(81873) |
4 |
2026-01-05 - 2026-04-10 (W)
14:00 - 15:50
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LAB H41
(81874) |
4 |
2026-01-05 - 2026-04-10 (R)
14:00 - 15:50
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LAB H51
(85958) |
4 |
2026-01-05 - 2026-04-10 (F)
14:00 - 15:50
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