ECE 457 - Microfabrication and Devices

★ 3 (fi 8)(EITHER, 3-0-2)

Faculty of Engineering

Microfabrication processes for CMOS, bipolar, MEMS, and microfluidics devices. Laboratory safety. Deposition processes of oxidation, evaporation and sputtering. Lithography, wet and dry etch, and device characterization. Note: Consent of Department required. Credit may be obtained in only one of ECE 457 or E E 457.

No syllabi

Fall Term 2024

Lectures

Section Capacity Class times Instructor(s)
LECTURE A1
(51673)
28
2024-09-03 - 2024-12-09 (TR)
08:00 - 09:20
NRE 2-016

Labs

Section Capacity Class times Instructor(s)
LAB D11
(49802)
4
2024-09-03 - 2024-12-09 (M)
14:00 - 15:50
ECERF W1-060
LAB D21
(46820)
4
2024-09-03 - 2024-12-09 (T)
14:00 - 15:50
ECERF W1-060
LAB D22
(53067)
4
2024-09-03 - 2024-12-09 (T)
16:00 - 17:50
ECERF W1-060
LAB D31
(46785)
4
2024-09-03 - 2024-12-09 (W)
14:00 - 15:50
ECERF W1-060
LAB D32
(53068)
4
2024-09-03 - 2024-12-09 (W)
16:00 - 17:50
ECERF W1-060
LAB D41
(49838)
4
2024-09-03 - 2024-12-09 (R)
14:00 - 15:50
ECERF W1-060
LAB D51
(46784)
4
2024-09-03 - 2024-12-09 (F)
14:00 - 15:50
ECERF W1-060

Winter Term 2025

Lectures

Section Capacity Class times Instructor(s)
LECTURE B1
(70508)
20
2025-01-06 - 2025-04-09 (MWF)
09:00 - 09:50
TBD

Labs

Section Capacity Class times Instructor(s)
LAB H11
(77500)
4
2025-01-06 - 2025-04-09 (M)
14:00 - 15:50
ECERF W1-060
LAB H21
(77156)
4
2025-01-06 - 2025-04-09 (T)
14:00 - 15:50
ECERF W1-060
LAB H31
(72132)
4
2025-01-06 - 2025-04-09 (W)
14:00 - 15:50
ECERF W1-060
LAB H41
(72133)
4
2025-01-06 - 2025-04-09 (R)
14:00 - 15:50
ECERF W1-060
LAB H51
(77157)
4
2025-01-06 - 2025-04-09 (F)
14:00 - 15:50
ECERF W1-060